U. Noyan, S. Lu, A. Al-Shabili, M. Dandin, S. H. Chan and P. Abshire, “Pulsed ToF LiDAR-Based Depth Imaging: SPAD Circuit Considerations and Simulation Study,” 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS), Tempe, AZ, USA, 2023, pp. 875-879
Y. Gilpin, J. Yankel and M. Dandin, “Field Uniformity Optimization for Integrated Capacitance Sensing of Tumor Treating Field-Treated Cancer Cell Cultures,” 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS), Tempe, AZ, USA, 2023, pp. 728-732
Y. Gilpin, C. -Y. Lin, M. Forssell, S. Zheng, P. Grover and M. Dandin, “Tracking the Effects of Tumor Treating Fields on Human Breast Cancer Cells in vitro Using a Capacitance Sensing Lab-on-CMOS Microsystem,” 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS), Glasgow, United Kingdom, 2022, pp. 1-4
M. S. R. Sajal et al., “Towards CMOS Capacitance Sensors for DNA Origami Characterization,” 2023 International Electron Devices Meeting (IEDM), San Francisco, CA, USA, 2023, pp. 1-4
M. S. Sajal and M. Dandin, “Challenge-Response Pair Space Enhancement for Imager-Based Physically Unclonable Functions,” 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS), Tempe, AZ, USA, 2023, pp. 217-221
F. Dehghandehnavi, M. S. Sajal, K. -C. Lin and M. Dandin, “Spectral Responsivity and Photoresponse Non-Uniformity of a Perimeter-Gated Single-Photon Avalanche Diode Imager,” 2023 IEEE 66th International Midwest Symposium on Circuits and Systems (MWSCAS), Tempe, AZ, USA, 2023, pp. 317-321
M. S. Sajal and M. Dandin, “Concealable Physically Unclonable Functions and Key Generation Using a Geiger Mode Imager,” 2023 IEEE International Symposium on Circuits and Systems (ISCAS), Monterey, CA, USA, 2023, pp. 1-5
M. S. Sajal, K. -C. Lin, B. Senevirathna, S. Lu and M. Dandin, “Perimeter-Gated Single-Photon Avalanche Diode Imager with Vanishing Room Temperature Dark Count Probability,” 2022 29th IEEE International Conference on Electronics, Circuits and Systems (ICECS), Glasgow, United Kingdom, 2022, pp. 1-4
T. Delbruck, I. A. M. Elfadel, S. Muzaffar, G. Haessig, et al., “Lessons Learned the Hard Way,” 2020 IEEE International Symposium on Circuits and Systems (ISCAS), Sevilla, 2020, pp. 1-18
B. Senevirathna, S. Lu, N. Renegar, M. Dandin, E. Smela, and P. Abshire, “System-on-a-chip for automated cell assays using a lab-on-CMOS platform,” in 2019 IEEE International Symposium on Circuits and Systems (ISCAS), 2019, pp. 1-5.
